PCB Simulation & Analysis

During the design phase and depending on the board complexity level, Signal Integrity, Power Integrity, EMI, PDN analysis, Thermal Analysis and 3D modeling are performed to find out and resolve any issues before fabrication of the board.

Areas of Simulation & Analysis:

  • Pre and Post Layout Simulations;
  • Impedance Control;
  • Delay matching;
  • Simulation using Spice, HSpice and IBIS Models;
  • Eye Pattern analysis for multi-gigabit channels;
  • Crosstalk Analysis;
  • PDN analysis;